Business
Precision Laser Processing
FMM Manufacturing / Cutting
Laser Patterning, Laser Repair for fine Metal Mask
With ultra short pulse laser for cold-cut process, direct patterning or repair process on the material can be achieved without any burr occurred.
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FI 1000 / CI 1000
All in one FMM stick Fabricate Machining
- Laser: Cold ablation by ultrashort pulse duration
- Mask projection: Finely controlled shaping
- Linear stage motion: Seamless processing
- Unique process: Exclude harmful thermal effect
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Application
- OLED Organic Evaporation Process
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FI 1000
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CI 1000
Main Specifications
| Item | Specification | |
|---|---|---|
| System configuration |
1) Laser and optics unit 2) Stage and invar sheet chucking unit(ESC) 3) Alignment and measurement unit(Vision) 4) Electric and control unit(OP PC) |
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| System Size | 3000*4000*2200(W*L*H) ㎜2 | |
| Available workpiece | Material | Invar film 10 ~ 300㎛ |
| Process target |
1) FMM pattern 2) Dummy(half etching, through hole, slit) / cutting |
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| Installation environment | Temp/Humidity | Temperature control ≤ ±1° Humidity control ≤ ±5% |
| Clean room | Class 1000 | |
| Vibration | VC-C | |
| Laser | Femtosecond laser | |
| Optics | Beam shaping and projection optics | |
| FMM process | Process shape | Circle, square and polygon shape |
| Min. hole size | Φ10μm for circle, □10μm for square | |
| Size accuracy(3σ) | ≤ ±1.0μm | |
| Positioning accuracy(3σ) | ≤ ±1.0μm | |
| Stage | X, Y, Z and θ axis | |
| Accuracy | ≤ ±1μm | |
| Work handling and chucking | Manual loading & unloading | |
| Substrate chuck | ≤ ±1μm | |
| Flatness | ≤ 20μm | |
| Alignment | Lens magnification | 10X, 20X,. 50X(optional) |
| Alignment accuracy | ≤ ±1μm | |
Process performance
FMM Repair
CIR 1000
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Automatic & Multi Function FMM Repair Machine
- Various type and shape of Defect Repair Support
- Defect CD and position accuracy Control in 1μm
- Holes Taper Angle Control Available
- Full Automatic FMM Repair Process
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Application
- Defect removal after FMM Processing
Main Specifications
| Item | Specification | |
|---|---|---|
| System configuration |
1) Laser and optics unit 2) Stage and invar sheet chucking unit (ESC) 3) Alignment and measurement unit (Vision) 4) Electric and control unit (Operation PC) |
|
| System Size | Main Body | 3700 x 3500 x 2800(mm) |
| Loader | 2400 x 2200 x 2800(mm) | |
| Available workpiece | Material | Invar film 10 ~ 300µm |
| Process target | 1) FMM Repair 2) FMM Shape cutting |
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| Laser | Femtosecond laser | |
| FMM process | Process shape | Circle, Square, Diamond, Hexagon, Polygon Shape |
| Min. hole size | Φ10μm for circle, □10μm for square | |
| Size accuracy(3σ) | ≤ ±1.0μm | |
| Positioning accuracy(3σ) | ≤ ±1.0μm | |
| Stage | X, Y, Z and θ axis | |
| Accuracy | ≤ ±1μm | |
| Work handling and chucking | Automatic loading & unloading ≤ 300mm (width) | |
| Substrate chuck | ESC(Electro-Static Chuck) | |
| Flatness | ≤ 20μm | |
Process performance
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Auto Repair Process Video
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Automatic FMM loader